• Antistatic, low tribocharging
  Minimizes charge generation; material will conduct charges if grounded
• Dissipative - corrosion resistant
  Ideal for long term storage
• Uniform protection
  Will not affect the solderability of device leads
• Lead-free RoHS Compliant
• Made in America

High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge.

Size: 24" x 36"
Volume Resistivity: 10E3 - 10E5 ohms
Surface Resistivity: 10E3 - 10E5 ohms